中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2016, Vol. 16 ›› Issue (8): 37 -40. doi: 10.16257/j.cnki.1681-1070.2016.0096

• 微电子制造与可靠性 • 上一篇    下一篇

薄外延CMOS芯片阱掺杂浓度与击穿电压的关系

韩兆芳,谢 达,乔艳敏   

  1. 中国电子科技集团公司第58研究所,江苏无锡 214035
  • 收稿日期:2016-04-27 出版日期:2016-08-20 发布日期:2016-08-20
  • 作者简介:韩兆芳(1975—),男,山东济宁人,工学硕士,毕业于西安电子科技大学技术物理学院,现在中国电子科技集团公司第58研究所从事集成电路及元器件失效分析工作。

Research of Relationship Between Well Doping Concentration and Breakdown Voltage in Thin-Epitaxy CMOS Chips

HAN Zhaofang,XIE Da,QIAO Yanmin   

  1. China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China
  • Received:2016-04-27 Online:2016-08-20 Published:2016-08-20

摘要: CMOS电路由于寄生结构的影响,易于发生闩锁效应。主要通过流片实验测试验证,探讨了在外延厚度较薄的情况下阱掺杂浓度与击穿电压之间的关系。提出了在不改变外延厚度、保证芯片抗闩锁性能的前提下,提高CMOS器件击穿电压的方法。

关键词: CMOS集成电路, 闩锁效应, 外延片, 穿通击穿

Abstract: Potential parasitic structure in CMOS integrated circuits may cause latch-up effect from time to time.To solve the problem,the paper makes experiments to explore the relationship between well doping concentration and breakdown voltage in CMOS chips with thin epitaxy technique via wafer testing. Aneffective method increasing breakdown voltage of CMOS deviceswhile retaining epitaxy thickness and anti-latch-up capability is proposed.

Key words: CMOS integrated circuit, latch-up effect, epitaxy wafer, punch-through breakdown

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