中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装 ›› 2020, Vol. 20 ›› Issue (12): 120203 . doi: 10.16257/j.cnki.1681-1070.2020.1207

• 封装、组装与测试 • 上一篇    下一篇

基于弹性连接器的板级垂直互连技术

王辉;徐榕青;董乐;李阳阳;庞婷   

  1. 中国电子科技集团公司第二十九研究所,成都? 610036
  • 收稿日期:2020-07-09 发布日期:2020-07-31
  • 作者简介:王辉(1984—),男,陕西西安人,西安交通大学硕士毕业,高级工程师,现从事微系统集成工艺技术方向的研究。

Board-level Vertical Interconnection Based on Elastic Connector

WANG Hui, XU Rongqing, DONG Le, LI Yangyang, PANG Ting   

  1. The 29th Research Institute of CETC, Chengdu610036, China
  • Received:2020-07-09 Published:2020-07-31

摘要: 垂直互连技术具有互连路径短、平面空间占用少等优点,是实现电子系统微型化的一种重要互连方式。设计了一种由导电硅橡胶和金属底盘组成的弹性连接器结构,它通过弹性压接方式直接实现基板与封装电路之间的信号传输。通过相应的试验测试,该弹性连接器在0~18 GHz频段内插损优于2 dB,在18~40 GHz频段内插损优于5 dB,且在0~40 GHz频段内驻波小于2,基本满足射频互连的使用要求。

关键词: 弹性连接器, 垂直互连, 3D封装, 射频互连

Abstract: Vertical interconnection technology has the advantages of short interconnection paths and less plane space occupation. It is an important interconnection method for miniaturizing electronic systems. In this paper, we designed an elastic connector structure composed of conductive silicon rubber and metal chassis, the signal transmission between the board and the package circuit is achieved. Through experimental tests, the insertion loss of the elastic connector is better than 2 dB in 0-18 GHz band, better than 5 dB in 18-40 GHz band and the standing wave is less than 2 in 0-40 GHz. The elastic connector basically meets the requirements of RF interconnection.

Key words: elasticconnector, verticalinterconnection, 3Dpackaging, RFinterconnection

中图分类号: