关键词: 导电胶, 树脂溢出, 表面能, 极性力

Abstract: Conductive adhesive is widely used in assembly process of ceramic substrate. Resin bleeding out often occurs during adhesive placement, and serious bleeding out will lead to the failure of the subsequent process. The efficiency and quality will also affected by it. There is no obvious correlation between resin bleed out and total energy of ceramic substrate, but there is a positive correlation between resin bleed out and porosity of substrate and surface polarity contamination. The removal effect of polarity pollution on substrate is analyzed by baking test under different conditions, an efficient method for improving the resin bleed out is given.

Key words: conductiveadhesive, epoxybleedout, surfaceenergy, polarityforce