中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2022, Vol. 22 ›› Issue (2): 020102 . doi: 10.16257/j.cnki.1681-1070.2022.0202

所属专题: 碳化硅功率半导体技术

• “碳化硅功率半导体器件”专题 • 上一篇    下一篇

碳化硅器件挑战现有封装技术

曹建武1;罗宁胜1;PierreDelatte2;EtienneVanzieleghem2;RupertBurbidge3   

  1. 1. CISSOID中国代表处,深圳 ?518118;2. CISSOID S.A., Mont Saint Guibert, 1435, Belgium;3.CISSOID S.A., Tarbes, 65000, France
  • 收稿日期:2021-12-06 出版日期:2022-02-23 发布日期:2022-01-23
  • 作者简介:曹建武(1964—),男,江苏宿迁人,本科,工程师,现任CISSOID中国区CTO,主要从事高温半导体器件的应用研究及碳化硅智能功率模块的设计、制造和测试。

SiC Device t oChallenge Existed Packaging Technologies

CAO Jianwu1, LUO Ningsheng1, DELATTE Pierre2, VANZIELEGHEM Etienne2, BURBIDGE Rupert3   

  1. 1. CISSOID ChineseOffice, Shenzhen 518118, China; 2. CISSOID S. A.,Mont Saint Guibert, 1435, Belgium;3. CISSOID S. A.,Tarbes, 65000, France
  • Received:2021-12-06 Online:2022-02-23 Published:2022-01-23

摘要: 碳化硅(SiC)器件的新特性和移动应用的功率密度要求给功率器件的封装技术提出了新的挑战。现有功率器件的封装技术主要是在硅基的绝缘栅双极晶体管(Insulated Gate Bipolar Transistor,IGBT)和金属氧化物半导体场效应晶体管(Metal Oxide Semiconductor Field Effect Transistor,MOSFET)等基础上发展起来的,并一直都在演进,但这些渐进改良尚不足以充分发挥SiC器件的性能,因而封装技术需要革命性的进步。在简述现有封装技术及其演进的基础上,主要从功率模块的角度讨论了封装技术的发展方向。同时讨论了功率模块的新型叠层结构以及封装技术的离散化、高温化趋势,并对SiC器件封装技术的发展方向做出了综合评估。

关键词: 功率器件, 碳化硅, 封装技术, 连接技术, 电力牵引驱动系统, 基板, 散热底板, 热膨胀系数

Abstract: The new characteristics of SiC devices and the higher power density demanding of mobile applications have put forward new challenges for the packaging technology of power devices. The packaging technology of existing power devices is mainly developed on the basis of Si based insulated gate bipolar transistor (IGBT) and metal oxide semiconductor field effect transistor (MOSFET) and has been continuously evolving, but these improvements are not enough to bring out the advanced performance of SiC devices. Therefore, packaging technology requires revolutionary progress. Based on the existing packaging technologies and related evolution, the development directions of the packaging technology, especially for the power modules are mainly discussed. In addition, the new laminated structures, and the discretization of packaging technologies, the trend of high temperature requirement are discussed. And comprehensive comment of the overall development directions of SiC device packaging technology is proposed.

Key words: SiC, powerdevice, packagingtechnology, connectingtechnology, electrictractiondrivingsystem, substrate, baseplate, coefficientofthermalexpansion

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