关键词: DIP封装器件, 多工况, 应力叠加, 失效分析

Abstract: Based on the failure of a DIP package device occurred in the machine temperature cycle test, failure simulation analysis with possible failure reasons under single and multiple working conditions were respectively performed through three periods including welding between the module and PCB, assembly between the machine and PCB and the machine temperature cycle test. Because of the superposition simulation problem for different simulation models under different working conditions, a stress superposition simulation method based on the finite element software ANSYS Workbench was proposed. The conclusion is made from simulation results comparison between single and multiple working conditions: the failure of DIP package device was caused by the glass insulator crack under combined action of mechanical stress and thermal stress under three working conditions including welding size mismatch, over-positioning assembly and temperature cycle test. The finite element simulation results were basically consistent with the test. A simulation method is provided with the stress superposition for the failure analysis of DIP package devices under multiple working conditions.

Key words: DIPpackagedevice, multipleworkingconditions, stresssuperposition, failureanalysis