SiC车用电机驱动研究发展与关键技术

doi:10.16257/j.cnki.1681-1070.2022.0301

摘要/Abstract

摘要： 摘? 要：碳化硅（SiC）器件具有低导通压降、可高速开关、可高温工作等优点，在车用电机驱动方面显示出巨大的技术优势和市场潜力。论述了SiC MOSFET器件实现高频、高温性能的难点，分别综述了模块、测试、电容、EMI滤波器、系统集成等方面的技术重点和主要研究方向，介绍了提升电机驱动产品性能的关键。

关键词: 碳化硅, 电机驱动, 电动汽车

Abstract: Silicon carbide (SiC) devices have the advantages of low on-state voltage, high-speed switching and high-temperature operation, which show great potential in motor drive application of electric vehicles. The difficulties in improving high frequency and high temperature performance of SiC MOSFETs are discussed, and the key technologies and main research topics in power module, test, capacitor, EMI filter, system integration are summarized.

Key words: siliconcarbide, motorcontroller, electricvehicle

中图分类号:

TM23

宁圃奇, 郑丹, 康玉慧, 陈永胜, 崔健, 张栋, 李晔, 范涛. SiC车用电机驱动研究发展与关键技术[J]. 电子与封装, 2022, 22(3): 030101 .

NING Puqi, ZHENG Dan, KANG Yuhui, CHEN Yongsheng, CUI Jian, ZHANG Dong, LI Ye, FAN Tao. Technical paths towards SiC E-motor controller for electric vehicles[J]. Electronics & Packaging, 2022, 22(3): 030101 .

参考文献

[1] 王东萃，崔宇航，于雷. SiC MOSFET在电动汽车领域的应用[J]. 上海汽车, 2021(8): 36-39.
[2] KHAZALA R, THOLLIN B, MENDIZABAL L, et al. Characterization of nanosilver dry films for high-temperature applications[C]// IEEE Transactions on Device and Materials Reliability, 2015, 15(2): 149-155.
[3] FAIZ M K, YAMAMOTO T, YOSHIDA M. Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application[C]// 2017 IEEE CPMT Symposium Japan (ICSJ), 2017: 195-198.
[4] KANG Y, NING P, YUAN T. Design and development of high voltage and high current SiC MOSFET modules[C]// PCIM Europe digital days 2020. International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, 2020: 1-6.
[5] NING P, LI L, WEN X, et al. Top die surface reprocessing for planar package with double sided cooling[C]// 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 2018: 2780-2785.
[6] BYUN H W, KIM N H. Two-phase refrigerant distribution in a two row/four pass parallel flow minichannel heat exchanger[J]. Experimental Thermal & Fluid Science: International Journal of Experimental Heat Transfer, Thermodynamics, and Fluid Mechanics, 2016, 77: 10-27.
[7] 施玉洁. 高速动车牵引变流器用板翅式热管散热器传热性能研究[D]. 南京: 南京工业大学, 2014.
[8] 云振新. 半导体致冷器件及其应用[J]. 半导体技术, 1990(6): 38-45.
[9] DENG Z S, LIU J. Capacity evaluation of a MEMS based micro cooling device using liquid metal as coolant[C]// IEEE International Conference on Nano/micro Engineered & Molecular Systems, 2007: 1311-1315.
[10] ZHU N, CHEN M, XU D H. A simple method to evaluate substrate layout for power modules[C]// International Conference on Integrated Power Systems. 2014: 1-6.
[11] CHEN Q, YANG X, WANG Z, et al. Analysis and suppression of inductive interference in an active integrated power electronics module[C]// 2007 IEEE Power Electronics Specialists Conference, 2007: 169-1625.
[12] VANWYK J D, LEE F C, LIANG Z, et al. Integrating active, passive and EMI-filter functions in power electronics systems: a case study of some technologies[C]// IEEE Transactions on Power Electronics, 2005, 20(3): 523-536.
[13] NING P, WANG F, NGO K. Automatic layout design for power module[C]// IEEE Transactions on Power Electronics, 2013, 28(1): 481-487.
[14] PANG Y F. Integrated thermal design and optimization study for active integrated power electronic modules (IPEMs)[D]. Blacksburg:Virginia Polytechnic Institute and State University, 2002.
[15] CARA D, CATALIOTTI A, MARSALA G, et al. Measurements methodology for the reliability evaluation of intelligent power modules[C]// Instrumentation & Measurement Technology Conference,IEEE, 2014: 665-669.
[16] SHOOK B W, NIZAM A, GONG Z, et al. Multi-objective layout optimization for multi-chip power modules considering electrical parasitics and thermal performance[C]// Control & Modeling for Power Electronics:IEEE, 2013: 1-4.
[17] 郝柏森. 多芯片SiC模块自动化低感布局设计研究[D]. 天津: 天津大学, 2018.
[18] NING P, WEN X, MEI Y, et al. A fast universal power module layout method[C]// 2015 IEEE Energy Conversion Congress and Exposition (ECCE), 2015, 4132-4137.
[19] IWATA Y, HAYASHI S, SATOH R, et al. An efficient thermal design method based on boundary condition modeling[C]// IEEE Transactions on Components & Packaging Technologies, 2006, 29(3): 594-603.
[20] 郝柏森，梅云辉，李欣，等. 一种基于多阶段遗传算法的功率模块自动化布局方法[J]. 天津大学学报：自然科学与工程技术版, 2019, 52(6): 47-53.
[21] KAMINSKI N, RUGEN S, HOFFMANN F.Gaining confidence - a review of silicon carbide's reliability status[C]// 2019 IEEE International Reliability Physics Symposium (IRPS), 2019: 1-7.
[22] HU B, GONZALEZ J O, RAN L, et al. Failure and reliability analysis of a SiC power module based on stress comparison to a Si device[C]// IEEE Transactions on Device and Materials Reliability, 2017, 17(4): 727-737.
[23] HEROLD C, SUN J, SEIDEL P, et al. Power cycling methods for SiC MOSFETs[C]// 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD), 2017: 367-370.
[24] HEROLD C, FRANKE J, BHOJANI R, et al. Requirements in power cycling for precise lifetime estimation[J]. Microelectronics Reliability, 2016, 58(3): 82-89.
[25 ]WEN H, XIAO W, WEN X, et al. Analysis and evaluation of DC-link capacitors for high-power-density electric vehicle drive systems[C]// IEEE Transactions on Vehicular Technology, 2012, 61(7): 2950-2964.
[26] 陈温良. 金属化电力电容器的热计算问题[J]. 电力电容器学会, 2003(S1): 53-57．
[27] 华征，王召盟，徐梦蕾，等. 高压全膜电容器三维温度场数值计算分析[J]. 电力电容器与无功补偿, 2017, 38(2): 94-99.
[28] 尹婷，严飞，李浩原，等. 金属化安全膜电容器ESR计算[J]. 电力电容器与无功补偿, 2015, 36(3): 41-44.
[29] LU X, PENG F Z. Minimizing DC capacitor current ripple and DC capacitance requirement of the HEV converter/inverter systems[C]// 2009 IEEE Energy Conversion Congress and Exposition, 2009: 1191-1198.
[30] 李晔，范涛，李琦，等.车用SiC电机驱动控制器用金属化膜电容研究[J].中国电机工程学报,2020,40(6):1801-1807.
[31] CHOI U M, BLAABJERG F, JRGENSEN S. Power cycling test methods for reliability assessment of power device modules in respect to temperature stress[J]. IEEE Transactions on Power Electronics, 2017, 3(3): 2531-2551.
[32] 朱俊杰，原景鑫，聂子玲，等. 基于全碳化硅功率组件的叠层母排优化设计研究[J]. 中国电机工程学报, 2019, 39(21): 6383-6393.
[33] CAO H, NING P, CHAI X, et al. Online monitoring of IGBT junction temperature based on Vce measurement[J]. Journal of Power Electronics, 2020, 21(2): 451-463.
[34] GELAGAEV R, JACQMAER P, DRIESEN J.A fast voltage clamp circuit for the accurate measurement of the dynamic ON-resistance of power transistors[J]. IEEE Transactions on Industrial Electronics, 2014, 62(2): 1241-1250.
[35] 项鹏飞，郝瑞祥，郝一，等. 基于PCB罗氏线圈的SiC MOSFET简化短路保护电路研究[EB/OL]. [2021-12-23]. http://kns.cnki.net/kcms/detail/11.2107.TM.20211028.1449.014.html.
[36] LUO H, MAO J, LI C, et al. Online junction temperature and current simultaneous extraction for SiC MOSFETs with electroluminescence effect[J]. IEEE Transactions on Power Electronics, 2022, 37(1): 21-25.
[37] LI C, LU Z, WU H, et al. Junction temperature measurement based on electroluminescence effect in body diode of SiC power MOSFET[C]// 2019 IEEE Applied Power Electronics Conference and Exposition (APEC), 2019: 338-343.
[38] BUTRON CCOA J A, STRAUSS B, MITIC G, et.al. Investigation of temperature sensitive electrical parameters for power semiconductors (IGBT) in real-time applications[C]// International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe, 2014: 1-9.
[39] KHATIR Z, DUPONT L, IBRAHIM A. Investigations on junction temperature estimation based on junction voltage measurements[J]. Microelectronics Reliability, 2010, 50(9-11): 1506-1510.
[40] KIM Y S, SUL S K. On-line estimation of IGBT junction temperature using on-state voltage drop[C]// 1998 IEEE Industry Applications Conference. IEEE, 1998: 853-859.
[41] DUPONT L, AVENAS Y. Evaluation of thermo-sensitive electrical parameters based on the forward voltage for on-line chip temperature measurements of IGBT devices[C]// 2014 IEEE Energy Conversion Congress and Exposition (ECCE), 2014: 4028-4035.
[42] XU Z, XU F, WANG F. Junction temperature measurement of IGBTs using short-circuit current as a temperature-sensitive electrical parameter for converter prototype evaluation[C]// IEEE Transactions on industrial electronics, 2015, 62(6): 3419-3429.
[43] LUO H, CHEN Y, SUN P, et al. Junction temperature extraction approach with turn-off delay time for high-voltage high-power IGBT modules[C]// IEEE Transactions on Power Electronics, 2016, 31(7): 5122-5132.
[44] VEMULAPATI U R, BIANDA E, TORRESIN D, et al. A method to extract the accurate junction temperature of an IGCT during conduction using gate-cathode voltage[C]// IEEE Transactions on Power Electronics, 2016, 31(8): 5900-5905.
[45] ZHANG Y, LI Q, JIANG D. A motor CM impedance based transformerless active EMI filter for DC side common-mode EMI suppression in motor drive system[C]// IEEE Transactions on Power Electronics, 2020: 1.
[46] DI PIAZZA M D, RAGUSA A, VITALE G. An optimized feedback common mode active filter for vehicular induction motor drives[J]. IEEE Transactions on Power Electronics, 2011, 26(11): 3153-3162.
[47] LI M, SHEN M, XING L, et al. Current feedback based hybrid common-mode EMI filter for grid-tied inverter application[C]// 2012 IEEE Energy Conversion Congress and Exposition (ECCE), 2012: 1394-1398.
[48] GOSWAMI R, WANG S. Investigation of multiple feedback active filter configurations for differential mode(DM) electromagnetic interference(EMI) noise in AC/DC converter applications[C]// IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, 2017: 7018-7023.
[49] CAO H, NING P, WEN X, et al. A genetic algorithm based motor controller system automatic layout method[C]// International Conference on Power Electronics and ECCE Asia.
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