关键词: 数字信号处理器, 系统级封装, 插入损耗

Abstract: With the development of radar equipment integration requirements, more stringent requirements are put forward on the quality and size of subsystems or modules. Lightweight, miniaturization and systematization are the development trends of the whole machine. The system size is reduced to 24% of the pre-package size by the system-level package design of multiple digital signal processor (DSP) chips. The simulation results show that the power plane of the system has no obvious resonance within 30 MHz, and the insertion loss of high-speed signal is greater than or equal to－3 dB@5 GHz, the return loss is less than or equal to －14 dB@5 GHz, the eye height of the simulated eye diagram is 314 mV, and the eye width is 0.68 UI, which meet the requirements of signal integrity. Thermal analysis shows that the highest junction temperature of the heat dissipation module is 55.8 ℃, which meets the actual requirements. Through the engineering application test, the scheme has the characteristics of small volume and simple operation compared with the traditional scheme.

Key words: digital signal processor, system in package, insertion loss