中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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导电胶粘接片式器件的接触电阻试验研究

李文,冯雪华,张信波,朱小会   

  1. 中国电子科技集团公司第二十九研究所,成都 610036
  • 收稿日期:2022-06-07 修回日期:2022-07-30 出版日期:2022-09-28 发布日期:2022-09-28
  • 通讯作者: 李文

Experimental Study on Contact Resistance of Conductive Adhesive Bonded Chip Devices

LI Wen, FENG Xuehua, ZHANG Xinbo, ZHU Xiaohui   

  1. China Electronics Technology Group Corporation No.29 Research Institute, Chengdu 610036, China
  • Received:2022-06-07 Revised:2022-07-30 Online:2022-09-28 Published:2022-09-28
  • Contact: li /WEN

摘要: 微波电路包含大量的片式电容、电阻,绝大部分采用导电胶粘接的装配方式。针对导电胶粘接片式器件的接触电阻进行了试验研究,分析了接触电阻对微波电路性能的影响机理,从电极材料、固化参数、导电胶量方面进行了试验研究。结果表明,片式器件电极材料是导致接触电阻变大的主要原因,固化参数对接触电阻变大有一定的影响,固化时间越长,接触电阻越稳定,粘接所用导电胶的胶量对接触电阻变化没有影响。可以通过采用Au/Ag电极材料、适当增加固化时间、在器件电极端头与基板焊盘之间压接金带来减小接触电阻。

关键词: 导电胶, 接触电阻, 电极材料, 固化参数, 导电胶量

Abstract: Microwave circuits contain a large number of chip capacitors and resistors, most of which are assembled by conductive adhesive bonding. The contact resistance of conductive adhesive bonded chip devices is experimentally studied,and the influence mechanism of contact resistance on the performance microwave circuits is analyzed. The experimental research is carried out from the aspects of electrode material, curing parameters and the amount of conductive adhesive. The results show that the electrode material of chip devices is the main reason affecting the increase of contact resistance, the curing parameters have a certain influence on the increase of contact resistance, the longer the curing time is, the more stable the contact resistance is, and the amount of conductive adhesive used for bonding has no effect on the change of contact resistance. The contact resistance can be reduced by using Au/Ag electrode material, appropriately increasing the curing time and welding gold between the device electrode end and the substrate pad.

Key words: conductive adhesive, contact resistance, electrode material, curing parameters, amount of conductive adhesive