中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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• 封装、组装与测试 •    下一篇

铜带缠绕型CCGA的加固工艺参数优化

张国光1,田文超2,刘美君2,从昀昊2,陈思3   

  1. 1. 佛山市蓝箭电子股份有限公司,广东 佛山 528051;2. 西安电子科技大学机电工程学院,西安 710068;3. 工业和信息化部电子第五研究所电子元器件可靠性物理及其应用技术国家级重点实验室,广州 511370
  • 收稿日期:2022-07-13 修回日期:2022-08-01 出版日期:2022-09-30 发布日期:2022-09-30
  • 通讯作者: 张国光

Optimization of Reinforcement Process Parameters for Copper Tape Winding CCGA

ZHANG Guoguang1, TIAN Wenchao2, LIU Meijun2, CONG Yunhao2, CHEN Si3   

  1. 1. Foshan Blue Rocket Electronics Co., Ltd., Foshan 710068, China; 2. School of Mechano-Electronic Engineering, Xidian University, Xian 710068, China; 3. State Key Lab of Reliability Physics and Application Technology of Electronic Components, CEPREI, Guangzhou 710068, China
  • Received:2022-07-13 Revised:2022-08-01 Online:2022-09-30 Published:2022-09-30

摘要: 基于有限元分析理论,针对铜带缠绕型CCGA的加固工艺进行仿真,明确不同工艺参数对器件焊接残余应力的影响规律,以残余应力最小为准则,获取了加固工艺的优选参数组合为:使用FP4526型填充胶,在靠近基板端底部灌封填充高度为0.622 mm的固化胶,在起始温度为25 ℃、升温速率为5 ℃/min、升温时长为25 min、固化温度为150 ℃、固化时间为120 min、降温速率为5 ℃/min的条件下加热,此时产生的最大残余应力是9.4974 MPa。

关键词: 铜带缠绕型, 陶瓷柱栅阵列, 加固工艺, 残余应力

Abstract: Based on the finite element analysis theory, this thesis conducts simulation research on the reinforcement process of copper tape wound CCGA, and the influence law of different process parameters on welding residual stress of devices is clarified. Taking the minimum residual stress as the criterion, the preferred combination of parameters for the reinforcement process is obtained as follows: the curing adhesive with 0.622 mm thickness is filled close to the bottom of the substrate end by using FP4526 filling adhesive. The heating method is adopted: the initial temperature is 25 ℃, the heating rate is 5 ℃/min, the heating time is 25 min, the curing temperature is 150 ℃, the curing time is 120 min, and the cooling rate is 5 ℃/min. The maximum residual stress is 9.4974 MPa.

Key words: copper tape winding type, ceramic column grid array, reinforcement process, residual stress