中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装

• 封装、组装与测试 •    下一篇

塑封倒装焊Bump Crack分析及改善研究

朱国灵,季振凯,纪萍,徐小明   

  1. 无锡中微亿芯有限公司,江苏 无锡 214072
  • 收稿日期:2022-07-21 修回日期:2022-08-14 出版日期:2022-10-10 发布日期:2022-10-10
  • 通讯作者: 朱国灵

Analysis and Improvement of Flip-chip for Bump Crack in Plastic Package

ZHU Guoling, JI Zhenkai, JI Ping, XU Xiaoming   

  1. East Technologies Inc., Wuxi 214072, China
  • Received:2022-07-21 Revised:2022-08-14 Online:2022-10-10 Published:2022-10-10

摘要: 随着科技的发展,半导体元器件小型化、高性能、轻量化的需求日益迫切,塑封倒装焊技术得到了广泛应用。因为基板的易形变性及各封装材料间的热膨胀系数不匹配,Bump Crack成为影响封装可靠性的重要因素之一。为了研究倒装焊产品在封装制程中Bump Crack的失效原因,利用有限元分析(ANSYS)软件建立倒装焊塑封封装体有限元模型,模拟Reflow过程中的塑封基板形变与凸点应力分布,并分析Bump Crack失效的原因。结果表明,在Reflow过程中,基板形变量大于裸芯,外围凸点倾斜较大,承受的应力及应变能最大,外沿凸点为最易失效点,采用加Boat作业可显著降低失效风险。

关键词: Bump Crack, 有限元分析, 失效分析

Abstract: With the development of science and technology, the demand for miniaturization, high performance, lightweight of semiconductor components is increasingly urgent, So the flip-chip plastic package technology has been widely used. Because of the deformation of substrate and the mismatch of thermal expansion coefficient between packaging materials, Bump Crack becomes one of the important factors affecting package reliability. In order to study the failure cause of Bump Crack in the package process, ANSYS is used to established the finite element model of flip-chip plastic package, the deformation of plastic substrate and the stress distribution of bump point in reflow process is simulated, and the failure cause of bump crack is analyzed. The results show that in the reflow process, the deformation quantity of substrate is larger than that of the bare core, and the bump point on the periphery is inclined greatly, which bears the largest stress and strain energy, so the bump point on the outer edge is the most vulnerable point to failure, and the Boat operation can significantly reduce the failure risk.

Key words: Bump Crack, finite element analysis, failure analysis