中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装

• 封装、组装与测试 •    下一篇

高密度陶瓷外壳焊盘位置度的标注与测量方法

刘洋,杨振涛,刘林杰   

  1. 中国电子科技集团公司第十三研究所,石家庄 050051
  • 收稿日期:2022-07-27 修回日期:2022-08-16 出版日期:2022-10-13 发布日期:2022-10-13
  • 通讯作者: 刘洋

Marking and Measuring Method of Pad Position for High Density Ceramic Shell

LIU Yang, YANG Zhentao, LIU Linjie   

  1. China Electronics Technology Group Corporation No.13 Research Institute, Shijiazhuang 050051, China
  • Received:2022-07-27 Revised:2022-08-16 Online:2022-10-13 Published:2022-10-13

摘要: 高密度陶瓷焊盘阵列外壳的焊盘位置度偏差直接影响着封装质量和可靠性。对国内外的位置度相关标准和标注方法进行了对比分析,给出了目前较为合理的位置度公差标注方法。在对现有位置度的测量方法进行分析的基础上,结合理论及数据分析,提出了一种采用抽取特征部位焊盘测量的方法,该方法能够高效且准确地获得高密度外壳焊盘的位置度。将采用该测量方法测试合格的样品进行了封装验证,测试合格,证明了标注与测量方法的合理性,该方法为高密度陶瓷外壳焊盘位置度标注与测量提供了参考。

关键词: 高密度陶瓷外壳, 焊盘, 位置度公差

Abstract: The packaging quality and reliability are directly affected by pad position deviation of high density ceramic package. The relative standards and marking methods of positional tolerance at home and abroad are compared and analyzed, and the current reasonable method of position tolerance marking is given. Based on the analysis of the existing position measurement methods, combined with the theory and data analysis, this paper proposes a method of measuring the position degree of high-density shell pads by extracting characteristic parts, which can obtain the position degree of high-density shell pads efficiently and accurately. The samples that passed the test by this measurement method are encapsulated and verified, which prove the rationality of the labeling and measurement method, and provide a reference for the position labeling and measurement of high-density ceramic shell solder pads.

Key words: high density ceramic shell, pad, position tolerance