电子与封装
• 封装、组装与测试 • 下一篇
周金成，潘霞，李习周
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ZHOU Jincheng, PAN Xia, LI Xizhou
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摘要： 分析了引线框架封装中铜丝键合的SSB（Stand-off Stitch Bond）互联的各种技术难点，并研究和验证了解决方案。从芯片、制具、材料、工艺等方面，分析了芯片的表面质量、键合夹具、键合劈刀等对铜丝SSB工艺的关键影响。研究了不同保护气体下的无空气球（FAB）尺寸的稳定性和不同保护装置中FAB形状的稳定性，以及防止铜丝SSB键合焊盘损伤和控制“铝挤出”的技术，确定了SSB工艺控制的要点及改善方法，并通过试验证实了所述措施与方法的有效性。
关键词: 铜丝SSB键合, 无空气球, 氧化, 焊盘损伤, 铝挤出
Abstract: Various technical difficulties of SSB (Stand-off Stitch Bond) interconnection for copper wire bonded in leadframe packages are analyzed, and the solution is studied and verified. The key effects of chip surface quality, bonding fixture and bonding capillary on the SSB process of copper wire are analyzed in terms of chip, manufacturing tool, material, and process. The stability of the free air ball (FAB) size under different protective gases and the stability of the FAB shape in different protective devices, as well as the techniques to prevent damage to the bonding pads of copper wire SSB and to control “Al splash” are studied, and the main points of the SSB process control and improvement methods are determined, and the effectiveness of the described measures and methods is verified through tests.
Key words: copper wire SSB bonding, free air ball, oxidation, bonding pad damage, Al splash
周金成, 潘霞, 李习周. 铜线SSB互联技术的难点及工艺控制[J]. 电子与封装, doi: 10.16257/j.cnki.1681-1070.2023.0026.
ZHOU Jincheng, PAN Xia, LI Xizhou. Difficulties and Process Control of Copper Wire SSB Interconnection Technology[J]. Electronics & Packaging, doi: 10.16257/j.cnki.1681-1070.2023.0026.
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链接本文: http://ep.org.cn/CN/10.16257/j.cnki.1681-1070.2023.0026
