晶上系统:设计、集成及应用

doi:10.16257/j.cnki.1681-1070.2024.0091

摘要/Abstract

摘要： 晶上系统（SoW）是近年来兴起的一种晶圆级超大规模集成技术。SoW是在整个晶圆上集成多个同构同质或异构异质的芯粒，并且芯粒相互连接组成具有协同工作能力的晶圆级系统，是后摩尔时代进一步提升系统性能的有效技术方案。总结了SoW技术近年来的主要研究进展，对系统架构、网络拓扑、仿真建模、供电和散热等关键技术进行了介绍，并对SoW技术的发展和应用前景进行了展望。

关键词: 晶上系统, 先进封装, 晶圆级, 异构集成, 硅转接板

Abstract: System-on-wafer (SoW) is a wafer-level ultra large scale integration technology that has emerged in recent years. Multiple homogeneous or heterogeneous chips can be integrated on an entire wafer by SoW technology. With the interconnections on the wafer substrate, the chips can work collaboratively, which makes the SoW technology become an effective technical solution for further improving the performances of the electronic systems in the post Moore era. The main research progress of the SoW technology in recent years is summarized, and the key technologies such as system architecture, network topology, simulation modeling, power supply and heat dissipation are introduced. The development and application prospects of the SoW technology are also prospected.

Key words: system-on-wafer, advanced packaging, wafer-level, heterogeneous integration, silicon interposer

中图分类号:

TN305.94

刘冠东;王伟豪;万智泉;段元星;张坤;李洁;戚定定;王传智;李顺斌;邓庆文;张汝云. 晶上系统:设计、集成及应用[J]. 电子与封装, 2024, 24(8): 080201 .

LIU Guandong, WANG Weihao, WAN Zhiquan, DUAN Yuanxing, ZHANG Kun, LI Jie, QI Dingding, WANG Chuanzhi, LI Shunbin, DENG Qingwen, ZHANG Ruyun. System-on-Wafer: Design, Integration, and Applications[J]. Electronics & Packaging, 2024, 24(8): 080201 .

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