关键词: 低压差线性稳压器, 铜线焊接, 漏电流失效, 可靠性, ILD层裂纹

Abstract: Final test leakage failure or reliability failure is common in low dropout regulator (LDO) new product introduction, it is mostly due to interlayer dielectric (ILD) crack under bonding pad caused by over copper wire bonding. Through the analysis of the chip structure, the causes of LDO leakage failure are pointed out. At the same time, how to determine reasonable copper wire bonding parameters, how to detect the defects and failure analysis steps are discussed in details.

Key words: LDO, copperwirebonding, leakagefailure, reliability, ILDcrack