关键词: 低温共烧陶瓷（LTCC）, 可焊接性, 微晶玻璃

Abstract: The brazing strength and reliability of lowtemperature co-fired ceramic (LTCC) circuit board welding zone with other devicesdirectly affect the function, performance consistency and reliability of the entire assembly. The poor solderability of low temperature co-fired ceramic circuit substrates is most commonly caused by the glass phase floating on the surface of the solder pad. A nanosecond pulsed ultraviolet laser is used to clean the gold platinum-palladium pad at an average power of 1.32W and a frequency of 88 kHz to reduce the content of glass phase on the surface of the pad, so as to improve the soldering resistance of the substrate to the lead-tin solder and ensure the reliability of brazing.

Key words: low temperature co-fired ceramics (LTCC), solder ability, microcrystalline glass