中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2023, Vol. 23 ›› Issue (6): 060402 . doi: 10.16257/j.cnki.1681-1070.2023.0062

• 材料、器件与工艺 • 上一篇    下一篇

光电晶体管反向击穿特性研究

陈慧蓉;孔德成;张明;彭时秋   

  1. 无锡中微晶园电子有限公司,江苏 无锡 214035
  • 收稿日期:2022-10-31 发布日期:2023-06-26
  • 作者简介:陈慧蓉(1971—),女,江苏丹阳人,大专,高级工程师,主要从事半导体工艺、工艺评价结构设计技术和光电产品研发等工作。

Study of Reverse Breakdown Characteristics ofPhototransistors

CHEN Huirong, KONG Decheng, ZHANG Ming, PENG Shiqiu   

  1. Wuxi Zhongwei Microchips Co., Ltd., Wuxi 214035, China
  • Received:2022-10-31 Published:2023-06-26

摘要: 由于特殊的应用场景,光电晶体管与普通晶体管在性能参数和结构设计上存在较大差异,在器件设计时需要兼顾各项参数的影响。通过理论及仿真计算结合实验流片,归纳出工艺过程中影响NPN光电晶体管反向击穿的几种因素,包括掺杂浓度、结深以及放大倍数等,进而提出了可以提升光电晶体管耐压的工艺改进措施,实现了发射极反向击穿电压提高约20%,集电极-发射极反向击穿电压超过400 V。

关键词: 光电晶体管, 反向击穿, 掺杂浓度, 放大倍数

Abstract: Phototransistors are extremely different from ordinary transistors in performance parameters and structural designs due to their special application scenarios, and the influence of each parameter should be taken into account during device design. Through theoretical and simulation calculations combined with experimental tape-out, several factors affecting the reverse breakdown voltage of NPN phototransistors are summarized, including doping concentration, junction depth, and amplification, etc. Process improvement methods are then proposed to enhance the withstand voltage of phototransistors, achieving an increase in emitter-base reverse breakdown voltage of approximately 20% and a collector-emitter reverse breakdown voltage of 400 V or more.

Key words: phototransistors, reverse breakdown voltage, doping concentration, amplification

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