关键词: SiP模块, 三维堆叠, 球栅阵列结构封装技术, 数字T/R

Abstract: The design of two miniaturized three-dimensional system-in-package (SiP) transceiver frequency conversion modules for digital transmission and reception (T/R) components is studied and implemented. In order to obtain higher isolation and stray indexes, two SiP frequency conversion modules are designed to realize the primary frequency conversions of Ku band and S band respectively, and the modules integrate bidirectional amplifiers, filters and mixers, etc.SiP frequency conversion modules use a variety of technologies, such as 3D vertical interconnection, package on package (POP) and LC filters, the size of each module is only 14.2 mm×8.5 mm×3.8 mm.The combination of the two SiP modules realizes two transceiver frequency conversions from Ku band to 125 MHz, and the width of 8.5 mm is very suited for digital T/R components. The design solution of SiP modular digital T/R components is given.

Key words: SiP module, 3D stacking, ball grid arraypackaging technology, digital T/R