深紫外光刻工艺的环境控制

doi:10.16257/j.cnki.1681-1070.2023.0145

摘要/Abstract

摘要： 从室外环境、净化厂房环境和深紫外光刻机设备内部的微环境3个层面，梳理空气颗粒污染物、空气分子污染物和振动等工艺环境问题的来源，构建深紫外光刻工艺环境模型。分析准分子激光器、光路、上版系统、传片系统和主工作台等深紫外光刻机主要部件在工艺环境控制方面的特殊要求。研究深紫外光刻工艺使用的化学放大光刻胶的工作机理，分析空气分子污染物对光刻胶乃至整个光刻工艺的影响。研究空气颗粒污染物、空气分子污染物和振动有关的技术标准和控制等级要求。提炼、总结深紫外光刻工艺环境控制方案，从3个层面逐级开展空气颗粒污染物控制、空气分子污染物控制、温湿度控制和防微振工作。

关键词: 光刻工艺, 化学放大光刻胶, 环境控制, 空气分子污染物, 振动

Abstract: From three levels of outdoor environment, purification plant environment and microenvironment inside the deep ultra violet (DUV) lithography equipment, the sources of process environmental problems such as airborne particle contamination, airborne molecular contamination and vibration are sort out, and the DUVlithography process environment model is constructed.The special requirements for process environment control of the main components of the DUV lithography machine are analyzed, such as excimer laser, light path, reticle loading system, wafer transmission system and main work stage.The working mechanism of chemically amplified photoresists used in the DUV lithography process is studied, and the effects of airborne molecular contaminant on the photoresists and on the lithography process are analyzed.Technical standards and control level requirements related to airborne particle contamination, airborne molecular contamination and vibrationare studied. The environmental control scheme of DUV lithography process is refined and summarized, and the control of an airborne particle contamination, the control of airborne molecular contamination, the control of temperature and humidity, and the prevention of micro-vibration are carried out step by step.

Key words: lithography process, chemically amplified photoresists, environmental control, airborne molecular contamination, vibration

中图分类号:

TN305

范钦文,顾爱军. 深紫外光刻工艺的环境控制[J]. 电子与封装, 2023, 23(11): 110401 .

FAN Qinwen, GU Aijun. Environmental Control of Deep Ultra Violet Lithography Processes[J]. Electronics & Packaging, 2023, 23(11): 110401 .

参考文献

[1] HWAIYUG. 半导体集成电路制造手册[M].赵树武，陈松，赵水林，等译. 北京：电子工业出版社，2006: 663-682.
[2]WOLF S. Silcon processing for the VLSI era volume: Deep-submicron process technology[M]. California: Lattice Press, 2002:230.
[3]李艳丽，刘显和，伍强. 先进光刻技术的发展历程与最新进展[J]. 激光与光电子学进展，2022,59(9): 0922006.
[4] 朋小康，黄兴文，刘荣涛，等. 光刻胶成膜剂:发展与未来[J]. 应用化学，2021,38(9): 1079-1090.
[5]李小欧，顾雪松，刘亚栋，等. 193 nm化学放大光刻胶研究进展[J]. 应用化学，2021,38(9): 1105-1118.
[6]王春伟，李弘，朱晓夏. 化学放大光刻胶高分子材料研究进展[J]. 高分子通报，2005,2(4): 70-80.
[7]许箭，陈力，田凯军，等. 先进光刻胶材料的研究进展[J]. 影像科学与光化学，2011,29(6): 417-429.
[8]李自力，徐兴冉，湛江浩，等. 先进光刻材料[J]. 应用化学，2022,39(6): 859-870.
[9]陈金平，郝青山，王双青，等. 极紫外光刻胶产气的定性和定量检测[J]. 分析化学，2020,48(12): 1658-1665.
[10] 周金锋.半导体代工厂洁净室的设计、监控和管理案例分析[D]. 上海：上海交通大学，2009.
[11]洁净室施工及验收规范. 中国标准书号: GB 50591—2010[S]. 北京: 中国建筑工业出版社, 2010.
[12] 高明亮.300mm半导体工厂AMHS系统的分析、设计和控制策略的仿真研究[D]. 上海：上海交通大学,2011.
[13] ISO. Cleanrooms and associated controlled environments-part5: Operations[EB/OL].[2022-12-18]. https://www.iso.org.
[14] ISO. Cleanrooms and associated controlled environments-part7: Separative devices (clean air hoods, gloveboxes, isolators and minienvironments) [EB/OL]. [2022-12-18]. https://www.iso.org.
[15] ISO. Cleanrooms and associated controlled environments-biocontamination control-part1: General principles and methods [EB/OL].[2022-12-18]. https://www.iso.org.
[16] ISO. Cleanrooms and associated controlled environments-biocontamination control-part2: Evaluation and interpretation of biocontamination data [EB/OL]. [2022-12-18]. https://www.iso.org.
[17] ISO. Cleanrooms and associated controlled environments-Part 1: Classification of air cleanliness[EB/OL].[2022-12-18]. https://www.iso.org.
[18] Institute of Environmental Sciences and Technology. IEST-G-CC035.1 design considerations for airborne molecular contamination filtration systems in cleanrooms and other controlled environments[EB/OL]. [2022-12-18]. https://www.iest.org.
[19] Institute of Environmental Sciences and Technology. IEST-RP-CC031.3 method for characterizing outgassed organic compounds from cleanroom materials and components [EB/OL]. [2022-12-18]. https://www.iest.org.
[20] SEMI. SEMI F21-1102 classification of airborne molecular contaminant levels in clean environments [EB/OL].[2022-10-18]. https://www.semi.org.
[21] SEMI. SEMI E108-0307 test method for the assessment of outgassing organic contamination from minienvironments using gas chromatography/mass spectroscopy[EB/OL]. [2022-10-18]. https://www.semi.org.
[22] 钱刚.半导体洁净室AMC控制过程的管理[J].集成电路应用，2022,39(7): 41-44.
[23] ISO. Cleanrooms and associated controlled environments-part 8: Asssessment of air cleanliness by chemical concentration(ACC)[EB/OL].[2022-12-18]. https://www.iso.org.
[24] 冯卫中，马玉华.浅析半导体工厂组装车间内SO2的低浓度化方法[J].洁净与空调技术，2005(4): 53-56.
[25] 牛立科. 化学过滤器在微电子行业的应用研究[D]. 北京：北京建筑工程学院,2012.
[26] Entegris. SilverSet? chemical filters[EB/OL].[2023-05-08]. https://www.entegris.com/shop/en/USD/products/gas-filtration-and-
purification/amc-filters/stepper-and-scanner-filters/SilverSet-Chemical-Filters/p/SilverSetChemicalFilters.
[27] 姚长呈，巩岩. 深紫外光刻投影物镜温度特性研究[J].中国激光，2016,43(5): 270-279.
[28] 范学东. 深紫外光刻机的Lens flare监控优化[J].中国集成电路，2018, 27(8): 63-66, 86.
[29] 骆聪. 深紫外光刻投影物镜热像差仿真研究[D]. 北京：中国科学院研究生院(长春光学精密机械与物理研究所),2015.
[30]张海波，楼祺洪，周军，等. ArF准分子激光器线宽压缩技术[J]. 激光与光电子学进展，2009, 46(12): 46-51.
[31] 范元媛，周翊，刘广义，等.高效率ArF准分子激光复合腔技术研究[J]. 中国激光，2016,43(2): 7-12.
[32]王效顺，余吟山，王庆胜，等. 高效率放电抽运KrF准分子激光器[J]. 中国激光，2011，38(1): 7-11.
[33] 朱能伟. 高重复率ArF准分子激光器的关键技术研究[D]. 合肥: 中国科学技术大学,2017.
[34] 冯泽斌，周翊，江锐，等. 高重频KrF准分子激光器能量特性控制[J]. 红外与激光工程，2020, 49(11): 164-175.
[35] 刘卫静. 准分子激光器性能测试技术研究[D]. 北京：中国科学院大学，2013.
[36] 赵阳. 深紫外光刻复杂照明光学系统设计[D]. 长春: 中国科学院研究生院（长春光学精密机械与物理研究所），2010.
[37] 赵阳, 巩岩. 深紫外光刻照明系统光束整形单元的设计[J].光学精密工程，2011,19(1): 29-34.
[38] 刘建国. 耐高温紫外正型光刻胶和248nm深紫外光刻胶的研制[D]. 武汉：华中科技大学，2007.
[39] 冯明，黄庆安，李伟华，等. SU-8胶深紫外光刻模拟[J].半导体学报，2007,28(9): 1465-1470.
[40] KISHKOVICH O P, KINKEAD D A, HIGLEY J K, et al. Real-time methodologies for monitoring airborne molecular contamination in modern DUV photolithography facilities[C]// Metrology, Inspection, and Process Control for Microlithography XIII, Santa Clara, 1999.
[41] 工程隔振设计标准. 中国标准书号: GB 50463—2019[S]. 北京: 中国计划出版社, 2019.
[42] 建筑工程容许振动标准: GB 50868—2013[S]. 北京: 中国计划出版社, 2013.
[43]梁希强，万叶青，阮兵，等. 按建筑功能区要求确定振动控制区域划分方法的研究[J]. 建筑结构，2020,50(A1): 423-427.
[44] 电子工业防微振工程技术规范. 中国标准书号: GB 51076—2015[S]. 北京: 中国计划出版社, 2015.
[45] 北京杜克现实点泰克科技公司. 痕量级AMC空气分子污染物Ma Mb（NH3,HCL,HF等）监测[EB/OL]. [2023-05-07]. http://www.bjdktech.com/Products-27007303.html.
[46] Entegris. VaporSorb? II-ABC lithography track chemical air filters[EB/OL]. [2023-05-08].https://www.entegris.com/shop/en/
USD/products/gas-filtration-and-purification/amc-filters/process-tool-air-filters/VaporSorb-II-ABC-Chemical-Air-Filters/p/VaporSorbIIABCChemicalAirFilters.
[47] Entegris.Front opening unified pod platform with superior microenvironment control that provides clean and secure 300 mm wafer transport[EB/OL]. [2023-05-07]. https://www.entegris.com/shop/en/USD/products/wafer-handling/wafer-processing/300-mm-
front-opening-unified-pods-%28foups%29/Spectra-FOUPs/p/SpectraFOUPs.
[48] 赵阳, 巩岩. 提高深紫外光刻照明系统扩束单元光束均匀性的方法[J]. 光学学报, 2012, 32(8): 153-159.
[49] ROKITSKI R, ISHIHARA T, RAO R, et al. High reliability ArF light source for double patterning immersion lithography[J]. Proceedings of SPIE,2011, 7640(2): 76401Q.
[50] Entegris. GateKeeper? GPU EX media gas purifiers[EB/OL].[2023-05-08]. https://www.entegris.com/content/dam/product-
assets/gatekeepergpugaspurifiers/datasheet-gatekeeper-gpu-ex-media-gas-purifiers-10963.pdf.
[51] Entegris.MegaTorr? PS22 XCDA? gas purifiers[EB/OL]. [2023-05-07]. https://www.entegris.com/shop/en/USD/products/
gas-filtration-and-purification/gas-purifiers/MegaTorr-PS22-XCDA-Gas-Purifiers/p/GateKeeperMGTAutoRegenerableExtremeCleanDryAirGasPurifiers.
[52]北京杜克泰克科技公司. 在线式ppb级微量臭氧O3气体分析仪[EB/OL]. [2023-05-07]. http://www.bjdktech.com/Products-31743767.html.
[53] 北京杜克泰克科技公司. AMC空气分子污染物ppb级VOC监测系统[EB/OL]. [2023-05-07]. http://www.bjdktech.com/Products-35489430.html.
[54] 北京杜克泰克科技公司. EDK 7200在线式紫外吸收ppb级氮氧化物气体分析仪[EB/OL]. [2023-05-07]. http://www.bjdktech.com/Products-31743929.html.
[55] 盛乃援，李艳秋，韦鹏志，等. 工件台振动低敏感光刻系统协同优化方法[J]. 红外与激光工程，2019,48(12): 1215001.
[56] 姚劲松. 微振检测情况和防微振方法[EB/OL]. [2023-05-07]. https://www.shanghaitech.edu.cn/_upload/article/files/3d/3a/de7e30f14566b13c5151af3ce705/69ccff46-41ab-43b7-8ecb-f16a167feb79.pdf.
[57] AMICK H, BAYAT A. Meeting the vibration challenges of next-generation photolithography tools[J]. Sound & Vibration, 2002, 36(3): 22-24.

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