中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2018, Vol. 18 ›› Issue (6): 29 -32. doi: 10.16257/j.cnki.1681-1070.2018.0066

• 微电子制造与可靠性 • 上一篇    下一篇

技术成熟度评估在进口替代电子材料开发中的应用

赵 丹,邹嘉佳,管美章,范晓春   

  1. 中国电子科技集团公司第三十八研究所,合肥 230031
  • 出版日期:2018-06-20 发布日期:2020-02-19
  • 作者简介:赵 丹(1983—),男,浙江东阳人,硕士学历,高级工程师,现就职于中国电子科技集团公司第三十八研究所,主要从事雷达工艺总体技术研究。

Technology Readiness Assessment Used in Development of Electronic Materials for Import Substitution

ZHAO Dan, ZOU Jiajia, GUAN Meizhang, FAN Xiaochun   

  1. China Electronics Technology Group Corporation No.38 Research Institute, Hefei 230031, China
  • Online:2018-06-20 Published:2020-02-19

摘要: 根据电子材料的技术特点对在国外进口替代电子材料开发过程的技术成熟度等级进行了重定义。分析了电子材料技术成熟度与电子装备成熟度之间的关系,并使用基于CTE权重的技术成熟度评价方法,以微波复合介质板的进口替代研发为例进行了技术成熟度评价。

关键词: 电子材料, 技术成熟度等级, 关键技术元素, 微波复合介质板

Abstract: Technology readiness assessment was taken for domestic electronic materials which would substitute for imported products. Because of the unique characteristic of material, the relation between Technology Readiness Level(TRL) of electronic material and TRL of electronic equipment was studied. TRL of microwave laminates for import substitution was redefined based on weighted average of Critical Technology Elements (CTEs).

Key words: electronic materials, technology readiness level(TRL), critical technology elements(CTEs), microwave laminates

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