中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2016, Vol. 16 ›› Issue (9): 1 -5. doi: 10.16257/j.cnki.1681-1070.2016.0100

• 封装、组装与测试 •    下一篇

基于场协同理论的电子元件散热CFD数值模拟*

马芳芳1,云和明1,2,3,李永真1   

  1. 1.山东建筑大学热能工程学院,济南 250101;2.可再生能源建筑利用技术省部共建教育部重点实验室,济南 250101;3.山东省可再生能源建筑应用技术重点实验室,济南 250101
  • 收稿日期:2016-06-02 出版日期:2016-09-20 发布日期:2016-09-20
  • 作者简介:马芳芳(1990—),女,山东德州人,硕士研究生,研究方向为传热传质及应用。

CFD Numerical Simulation of Electronic Equipment Cooling in the Perspective of Field Synergy Principle

MA Fangfang1,YUN Heming123,LI Yongzhen1   

  1. 1.School of Thermal Energy Engineering,Shandong Jianzhu University,Jinan 250101,China;2.Key Laboratory of Renewable Energy Utilization Technologies in Building,Ministry of Education,Jinan 250101,China;3.Shandong Key Laboratory of Renewable Energy Application Technology,Jinan 250101,China
  • Received:2016-06-02 Online:2016-09-20 Published:2016-09-20

摘要: 针对电子元件的散热问题,以电子元件为研究对象,采用CFD技术对以空气为冷却流体的电子元件的6种散热方案进行了数值模拟。采用流体固体共轭传热技术,获得电子元件散热小空间的温度场及速度场。基于场协同原理对其温度场和速度场的协同效果进行分析和比较,获得电子元件散热的优化方案,为进一步提高电子元件的散热效果及热设计水平提供理论依据。

关键词: CFD, 数值模拟, 场协同原理, 共轭传热

Abstract: The paper simulates six cooling schemes for electronic components using CFD technology with air as cooling fluid and obtains the temperature and velocity fields in small space using fluid-solid conjugate heat transfer technology.After analyzing the synergy effect of the temperature and velocity fields using the field synergy principle,the optimized scheme is obtained,which improves the electronic components cooling performance and provides proofs for further studies.

Key words: CFD(computational fluid dynamics), numerical simulation, field synergy principle, conjugate heat transfer

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