中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (3): 030402 . doi: 10.16257/j.cnki.1681-1070.2021.0309

• 微电子制造与可靠性 • 上一篇    下一篇

低压调整二极管击穿特性分析与优化设计

陈正才;彭时秋;林丽;黄龙   

  1. ?无锡中微晶园电子有限公司,江苏 无锡? 214035
  • 收稿日期:2020-07-08 出版日期:2021-03-23 发布日期:2020-10-16
  • 作者简介:陈正才(1981—),男,江苏盐城人,硕士,高级工程师,现从事分立器件研究及应用。

Breakdown Characteristics Analysis and OptimizationDesign of Low Voltage Regulator Diode

CHEN Zhengcai, PENG Shiqiu, LIN Li, HUANG Long   

  1. Wuxi Zhongwei Microchips Co., Ltd.,Wuxi 214035, China
  • Received:2020-07-08 Online:2021-03-23 Published:2020-10-16

摘要: 介绍了采用平面结构设计与Si外延工艺制造低压调整二极管的技术。该技术论证了Si平面结型5.1 V低压调整二极管的击穿机理为隧道击穿,同时设计了一种新型Si平面结型低压调整二极管的结构,以及与此结构相匹配的工艺制程,进而实现5.1 V击穿电压特性为硬击穿。此硬击穿优化的关键是对结构设计、氧化工艺的深度研究。

关键词: 隧道击穿, 结构设计, 氧化工艺

Abstract: This paper introduces the technology of fabricating low voltage regulator diode by plane structure design and Si epitaxial process. The technology demonstrates that the breakdown mechanism of Si planar junction 5.1V low-voltage voltage regulating diode is tunnel breakdown. Meanwhile, the structure of a new Si planar junction low-voltage regulating diode and the process corresponding to this structure are designed to realize the breakdown voltage characteristic of 5.1V as hard breakdown. The key technologies of hard breakdown optimization are structural design and in-depth study of oxidation process.

Key words: tunnelbreakdown, structuredesign, oxidationprocess

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