溅射覆铜陶瓷基板表面研磨技术研究*
王哲;刘松坡;吕锐;陈红胜;陈明祥
Research on the Surface Grinding Process of Direct Plated Copper Ceramic Substrate
WANG Zhe, LIU Songpo, LYU Rui, CHEN Hongsheng, CHEN Mingxiang
电子与封装
.
2022, (3): 30201
-
.
DOI: 10.16257/j.cnki.1681-1070.2022.0312
