封装器件多应力叠加失效仿真分析与验证
李 逵, 张志祥, 杨宇军, 刘 敏
Failure Simulation Analysis and Verification of the
Package Device Under Multiple Stress Superposition Situation
LI Kui, ZHANG Zhixiang, YANG Yujun, LIU Min
电子与封装
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0, (): 0
-0
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DOI: 10.16257/j.cnki.1681-1070.2022.0316
