中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
板间连接器低空洞真空汽相焊接技术
邱静萍;王文智;李少聪;毛海珂;张绍东
Research on Low Void Vacuum Vapor SolderingTechnology of Printed Circuit Boards Electrical Connectors
QIU Jingping, WANG Wenzhi, LI Shaocong, MAO Haike, ZHANG Shaodong
电子与封装 . 2022, (5): 50201 - .  DOI: 10.16257/j.cnki.1681-1070.2022.0511