多芯片组件导电胶接触电阻增大案例分析*
张建;王道畅;金家富;董玉;李静
Case Analysisof Increased Contact Resistance of Conductive Adhesives for Multi-Chip Module
ZHANG Jian, WANG Daochang, JIN Jiafu, DONG Yu, LI Jing
电子与封装
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2022, (6): 60203
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DOI: 10.16257/j.cnki.1681-1070.2022.0609
