基于TSV倒装焊与芯片叠层的高密度组装及封装技术
汤姝莉, 赵国良, 薛亚慧, 袁海, 杨宇军
High Density Assembly and Packaging Technology Based on Flip-Chip on TSV and Chip Stacking
TANG Shuli, ZHAO Guoliang, XUE Yahui, YUAN Hai, YANG Yujun
电子与封装
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2022, (8): 80201
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DOI: 10.16257/j.cnki.1681-1070.2022.0803
