一种柔软高热导且连接界面稳定的半导体封装材料

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刘鹏, 杨诚

A Semiconductor Packaging Material with Soft, High Thermal Conductive and Stable Connection Interface

LIU Peng, YANG Cheng

电子与封装 . 2022, (3): 30601 - . DOI: 10.16257/j.cnki.1681-1070.2022.0315