环氧塑封料用热潜伏型固化促进剂的研究与应用进展*
王璐;常白雪;岳艺宇;吴宇林;吴昊;陈淑静;刘金刚
Progress on the Research and Application of Thermally Latent Curing Acceleratorsin Epoxy Molding Compounds
WANG Lu, CHANG Baixue, YUE Yiyu, WU Yulin, WU Hao, CHEN Shujing, LIU Jingang
电子与封装
.
2022, (9): 90201
-
.
DOI: 10.16257/j.cnki.1681-1070.2022.0901
