第三代半导体器件用高可靠性环氧塑封料的制备
王殿年;李泽亮;郭本东;段嘉伟
Preparation of High Reliability Epoxy Molding Compound for Third Generation Semiconductor Devices
WANG Diannian, LI Zeliang, GUO Bendong, DUAN Jiawei
电子与封装
.
2022, (11): 110202
-
.
DOI: 10.16257/j.cnki.1681-1070.2022.1110
