硅含量对硅铝合金电子封装材料性能的影响
李海军;宗福春;胡增武;李云飞;彭文佳;齐 敬
Effect of Si Content on the Properties of Si-Al Alloy for Electronic Packaging Materials
LI Haijun, ZONG Fuchun, HU Zengwu, LI Yunfei, PENG Wenjia, QI Jing
电子与封装
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2022, (12): 120203
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DOI: 10.16257/j.cnki.1681-1070.2022.1204
