双层基板塑封器件的声扫检查方法研究
田健;廖登华;李永梅;马清桃
Study on Acoustic Scanning Inspection Methodof Plastic Encapsulated Devices on Double-Layer Substrates
TIAN Jian, LIAO Denghua, LI Yongmei, MA Qingtao
电子与封装
.
2023, (4): 40204
-
.
DOI: 10.16257/j.cnki.1681-1070.2023.0032
