SiP封装的焊点形态对残余应力与翘曲的影响
王磊;金祖伟;吴士娟;聂要要;钱晶晶;曹纯红
Effectof Solder Joint Shape on Residual Stress and Warpage of SiP Package
WANG Lei, JIN Zuwei, WU Shijuan, NIE Yaoyao, QIAN Jingjing, CAO Chunhong
电子与封装
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2023, (4): 40203
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DOI: 10.16257/j.cnki.1681-1070.2023.0030
