芯片三维互连技术及异质集成研究进展*
钟毅, 江小帆, 喻甜, 李威, 于大全
Advances in Three-DimensionInterconnection Technology and Heterogeneous Integration of Chips
ZHONG Yi, JIANG Xiaofan, YU Tian, LI Wei, YU Daquan
电子与封装
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2023, (3): 30102
-
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DOI: 10.16257/j.cnki.1681-1070.2023.0041
