Sn晶粒取向对微焊点元素迁移及界面反应的影响<sup>*</sup>

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白天越, 乔媛媛, 赵宁

Influences ofSn Grain Orientation on Element Migration and Interfacial Reaction in MicroSolder Joints

BAI Tianyue, QIAO Yuanyuan, ZHAO Ning

电子与封装 . 2023, (3): 30101 - . DOI: 10.16257/j.cnki.1681-1070.2023.0037