铜带缠绕型CCGA的加固工艺参数优化*
张国光;田文超;刘美君;从昀昊;陈思;王永坤
Optimization of Reinforcement Process Parameters for CopperTape Winding CCGA
ZHANG Guoguang, TIAN Wenchao, LIU Meijun, CONG Yunhao, CHEN Si
电子与封装
.
2023, (2): 20203
-
.
DOI: 10.16257/j.cnki.1681-1070.2023.0010
10.16257/j.cnki.1681-1070.2023.0010
