一种用于先进封装的圆台硅通孔的刻蚀方法
林源为, 赵晋荣, 曹泽京, 袁仁志
A Plasma Etch Method for CircularTruncated Cone Through Silicon Via for Advanced Packaging
LIN Yuanwei, ZHAO Jinrong, CAO Zejing, YUAN Renzhi
电子与封装
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2023, (3): 30112
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DOI: 10.16257/j.cnki.1681-1070.2023.0066
