中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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大功率LED芯片直接固晶热电制冷器主动散热*
梁仁瓅,牟运,彭洋,胡涛,王新中
Active Heat Dissipation of High-Power LED Chip Directly Bonded on Thermoelectric Cooler
LIANG Renli, MOU Yun, PENG Yang, HU Tao, WANG Xinzhong
电子与封装 . 2023, (10): 100201 - .  DOI: 10.16257/j.cnki.1681-1070.2023.0124