半加成工艺中薄化铜后烘烤对剥离强度的影响
林君逸,俞宏坤,欧宪勋,程晓玲,林佳德
Effect of Baking After Electroless Cu Plating on Peel Strength in Semi-Additive Process
LIN Junyi,YU Hongkun,OU Xianxun,CHENG Xiaoling, LIN Jiade
电子与封装
.
2023, (9): 90202
-
.
DOI: 10.16257/j.cnki.1681-1070.2023.0123
