封装用环氧银胶的配制工艺及性能研究
鄂依阳;田兆波;迟克禹;江仁要;孙琪;吕尤;祝渊
Study on Preparation Technology and Properties of Epoxy Silver Adhesive Used for Encapsulation
E Yiyang, TIAN Zhaobo, CHI Keyu, JIANG Renyao, SUN Qi, LYU You, ZHU Yuan
电子与封装
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2023, (7): 70207
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DOI: 10.16257/j.cnki.1681-1070.2023.0096
