电镀纯锡镀层与钢带结合强度的优化研究<sup>*</sup>

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周杰,胡宇昆

Research on Optimization of Bonding Strength Between Plating Layer and Steel Strip for Electroplating Pure Tin

ZHOU Jie, HU Yukun

电子与封装 . 2023, (9): 90205 - . DOI: 10.16257/j.cnki.1681-1070.2023.0128