中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
激光烧结纳米铜膏成型线路的清洗工艺研究*
张坤,徐广东,李权震,杨冠南,张昱,崔成强
Research on Cleaning Process of Forming Circuits of Laser Sintering Nano Copper Paste
ZHANG Kun, XU Guangdong, LI Quanzhen, YANG Guannan,ZHANG Yu, CUI Chengqiang
电子与封装 . 2023, (9): 90206 - .  DOI: 10.16257/j.cnki.1681-1070.2023.0154