浅谈超导量子比特封装与互连技术的研究进展
汪冰,刘俊夫,秦智晗,芮金城,汤文明
Progress in Superconducting Quantum Bit Packaging and Interconnection Technology
WANG Bing, LIU Junfu, QIN Zhihan, RUI Jincheng, TANG Wenming
电子与封装
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2023, (10): 100207
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DOI: 10.16257/j.cnki.1681-1070.2023.0137
