基于陶瓷衬底的薄膜再布线工艺及组装可靠性研究

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朱喆,黄陈欢,李林森,刘俊夫

Thin Film Rerouting Process and Assembly Reliability Study Based on Ceramic Substrate

ZHU Zhe, HUANG Chenhuang, LI Linsen, LIU Junfu

电子与封装 . 2023, (10): 100208 - . DOI: 10.16257/j.cnki.1681-1070.2023.0167