硅基板盲孔制备及填镀铜工艺研究

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刘晓兰, 周拥华, 严英占

Research on the Blind via Fabrication in Silicon Substrate and via-Filling by Copper Electroplating

LIU Xiaolan, ZHOU Yonghua, YAN Yingzhan

电子与封装 . 2019, (12): 7 -11 . DOI: 10.16257/j.cnki.1681-1070.2019.1202