BGA封装电路焊球外观异常解决方案研究

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丁鹏飞,王恒彬,王建超

Research on Solution for Abnormal Appearances of Solder Balls in BGA Packaging Circuits

DING Pengfei, WANG Hengbin, WANG Jianchao

电子与封装 . 2023, (12): 120102 - . DOI: 10.16257/j.cnki.1681-1070.2023.0171