有机封装基板标准化工作现状及发展思考

导航

李锟,曹易,田欣,薛超

Current Status and Development Thoughts of Standardization Work on Organic Package Substrate

LI Kun,CAO Yi, TIAN Xin, XUE Chao

电子与封装 . 2024, (2): 20107 - . DOI: 10.16257/j.cnki.1681-1070.2024.0040