微电路模块异质黏接封装失效行为的研究

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黄国平,王晓卫,陈科科

Research on the Failure Behavior of Heterogeneous Bonding Packaging in Microcircuit Modules

HUANG Guoping, WANG Xiaowei, CHEN Keke

电子与封装 . 2024, (4): 40203 - . DOI: 10.16257/j.cnki.1681-1070.2024.0018