芯片封装测试产业上的功能安全

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吴世芳, 潘进豊

Topics on ISO 26262 Functional Safety for IC Packaging and Testing Vendor of Semiconductor

WU Shifang, PAN Jinli

电子与封装 . 2020, (4): 40101 - . DOI: 10.16257/j.cnki.1681-1070.2020.0401