铜引线键合中芯片焊盘裂纹成因及消除研究

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刘美, 王志杰, 孙志美, 牛继勇, 徐艳博

Crack Formation and Elimination Method on Bond Pad in Cu Wire Bonding

LIU Mei, WANG Zhijie, SUN Zhimei, NIU Jiyong, XU Yanbo

电子与封装 . 2019, (11): 14 -21 . DOI: 10.16257/j.cnki.1681-1070.2019.1104