有限元数值模拟在BGA/QFP/CCGA器件焊点可靠性研究中的应用
夏卓杰，张亮，熊明月，赵猛
Application of Finite Element Numerical Simulation in the Reliability Study of LeadFree Solder Joints in BGA/QFP/CCGA Devices
XIA Zhuojie, ZHANG Liang, XIONG Mingyue, ZHAO Meng
电子与封装
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2020, (2): 20101
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DOI: 10.16257/j.cnki.1681-1070.2020.0201
